Retail Opportunity Investments Corp
Change company Symbol lookup
Select an option...
ROIC Retail Opportunity Investments Corp
MS-I Morgan Stanley
ORGS Orgenesis Inc
LYFT Lyft Inc
AROC Archrock Inc
PACK Ranpak Holdings Corp
NVEE NV5 Global Inc
YARIY Yara International ASA
HYB New America High Income Fund
ACV Virtus Diversified Income & Convertible Fund
Go

Real Estate : Equity Real Estate Investment Trusts (REITs) | Small Cap Blend
Company profile

Retail Opportunity Investments Corp. (ROIC) is a fully integrated, self-managed real estate investment trust (REIT). The Company is engaged in the acquisition, ownership and management of necessity-based community and neighborhood shopping centers on the west coast of the United States, anchored by supermarkets and drugstores. It operates its business through, its operating partnership subsidiary, Retail Opportunity Investments Partnership, LP. The Company is organized in an umbrella partnership real estate investment trust (UpREIT) format pursuant to which Retail Opportunity Investments GP, LLC, serves as the general partner. The operating partnership holds all the assets of the Company and directly or indirectly holds the ownership interests in the Company’s real estate ventures. The Company’s portfolio consists of 90 properties totaling approximately 10.2 million square feet of gross leasable area (GLA).

Closing Price
$16.40
Day's Change
0.46 (2.89%)
Bid
--
Ask
--
B/A Size
--
Day's High
16.47
Day's Low
16.05
Volume
(Heavy Day)
Volume:
1,759,030

10-day average volume:
1,161,342
1,759,030

TSMC Files Annual Report on Form 20-F for 2021

7:18 am ET April 14, 2022 (BusinessWire) Print

TSMC (TWSE: 2330, NYSE: TSM) today filed its 2021 annual report on Form 20-F with the U.S. Securities and Exchange Commission.

The report is available at https://investor.tsmc.com/english/sec-filings. Hard copies of the report are also available, free of charge, upon email request to g_sec@tsmc.com.

ABOUT TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20220413005417/en/

SOURCE: TSMC

TSMC Spokesperson:
Wendell Huang
Vice President and CFO
Tel: 886-3-505-5901

Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com

Hui-Chung Su
Public Relations
Tel: 886-3-563-6688 ext. 7125033
Mobile: 886-988-930-039
E-Mail: hcsuq@tsmc.com
comtex tracking

COMTEX_405696418/1006/2022-04-14T07:18:00

Earnings Calendar and Events Data provided by |Terms of Use| © 2022 Wall Street Horizon, Inc.

Market data accompanied by is delayed by at least 15 minutes for NASDAQ, NYSE MKT, NYSE, and options. Duration of the delay for other exchanges varies.
Market data and information provided by Morningstar.

Options are not suitable for all investors as the special risks inherent to options trading may expose investors to potentially rapid and substantial losses.
Please read Characteristics and Risks of Standard Options before investing in options.

Information and news provided by ,, , Computrade Systems, Inc., ,, and

Copyright © 2022. All rights reserved.